| Company Name |
|
NIPPON MICROMETAL MALAYSIA SDN. BHD.
Company No: 201201032587 (1017075-U) |
| Address |
|
18-16 Menara Mutiara Sentral
No 2, Jalan Desa Aman 1
Cheras Business Centre
56000 Kuala Lumpur, Malaysia |
| Tel |
|
603-2856 2694 |
| Key Personnel |
|
Director Tadahiro Fukaya
Manager Jason Koh
|
| Nature of Business |
|
Au Bonding Wire, Cu Bonding Wire and Micro Solder Ball. |
| Main Shareholders/Parent Company |
|
Nippon Micrometal Corporation
158-1 Sayamagahara Iruma-City, Saitama 358-0032, Japan |
